Continuous Laser Cleaning Machine and Pulse Laser Cleaning Machine Working Principles

​Laser cleaning machines are categorized into continuous wave (CW) laser cleaning and pulsed laser cleaning based on their laser emission modes. Their working principles differ in terms of energy delivery, material interaction, and application suitability.

  • laser power1.5KW/2.0KW/3.0KW
  • size650mm*800mm*1350mm
  • weight150.0 kg
price$3000.0/Set - 5740.0/Set. More Earlier you buy, more discount you have.

Laser cleaning machines are categorized into continuous wave (CW) laser cleaning and pulsed laser cleaning based on their laser emission modes. Their working principles differ in terms of energy delivery, material interaction, and application suitability.


1. Continuous Wave (CW) Laser Cleaning Machine

Working Principle:

  • The laser emits a steady, uninterrupted beam of light with constant power.

  • The energy is delivered continuously to the surface, causing rapid heating of contaminants (rust, paint, oxides, etc.).

  • The contaminants absorb the laser energy, leading to thermal decomposition, vaporization, or combustion.

  • The base material (if properly selected) reflects or minimally absorbs the laser, preventing damage.

Key Characteristics:

  • Constant power output (e.g., 100W, 500W, 1000W fiber lasers).

  • Faster cleaning speed for large areas due to continuous energy delivery.

  • More heat accumulation, which may affect heat-sensitive materials.

  • Best for thick coatings, rust, and large-scale industrial cleaning.

Applications:

  • Removing paint from aircraft or ships.

  • De-rusting large metal structures.

  • Cleaning molds and industrial equipment.


2. Pulsed Laser Cleaning Machine

Working Principle:

  • The laser emits short, high-energy pulses (nanosecond, picosecond, or femtosecond durations).

  • Each pulse delivers peak power much higher than CW lasers, causing instantaneous ablation of contaminants.

  • The mechanism involves photomechanical breakdown (shockwave effect) and thermal ablation.

  • The short pulse duration minimizes heat transfer to the substrate, reducing thermal damage.

Key Characteristics:

  • High peak power (kW, MW, or even GW in ultrashort pulses).

  • Precise material removal with minimal thermal impact.

  • Lower average power compared to CW lasers but more effective for delicate cleaning.

  • Better for thin layers, oxides, and sensitive materials.

Applications:

  • Precision cleaning of electronics and semiconductors.

  • Removing oxide layers from delicate metal parts.

  • Restoration of cultural artifacts (paintings, historical monuments).


Comparison Table

FeatureCW Laser CleaningPulsed Laser Cleaning
Laser EmissionContinuous beamShort, high-energy pulses
Energy DeliveryConstant powerHigh peak power, low average power
Cleaning MechanismThermal decomposition/vaporizationAblation + shockwave effect
Heat InputHigher (risk of thermal damage)Lower (minimal heat-affected zone)
SpeedFaster for large areasSlower but more precise
Best ForThick coatings, rust, industrial useThin layers, precision cleaning

Conclusion

  • CW lasers are better for high-speed, large-scale industrial cleaning where heat accumulation is not critical.

  • Pulsed lasers are ideal for high-precision, delicate cleaning where thermal damage must be avoided.

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