The electronic equipment laser micro-machining system solution is mainly divided into three parts, one is the laser cutting machine, the other is the matching laser marking machine, and the third is the matching laser welding machine. The demand for laser micromachining equipment is mainly due to the structural characteristics of electronic devices. On the one hand, electronic devices have various shapes, diverse materials, and complicated structures. On the other hand, their walls are relatively thin and the processing precision is relatively high.
Typical examples include SMT templates, laptop case housings, mobile phone back covers, stylus pens, electronic cigarette tubes, media beverage straws, automotive valve cores, spool tubes, heat pipes, and tubes. At present, traditional processing techniques such as turning, milling, grinding, wire cutting, stamping, high-speed drilling, chemical etching, injection molding, MIM processing, 3D printing, etc. have their own advantages and disadvantages.
For example, the material of its construction is very wide. It has good surface processing quality and moderate processing cost, but it is not suitable for processing thin walls. The same is true for milling and grinding. The surface of the wire cut is really very good, but the processing efficiency is low. The efficiency of stamping is very high, the cost is relatively low, and the shape of the processing is also good, but the burr of the stamped edge of the processing and its indication accuracy are relatively low. The efficiency of chemical etching is very high, but the most important thing is that its environmental problems are an increasingly prominent requirement at all levels. In recent years, Shenzhen has strict environmental protection requirements, so many factories engaged in chemical etching have moved out. This is the main problem in the electronic device architecture.
In the field of fine processing of precision thin-walled parts, laser technology has the characteristics of strong complementarity with traditional machining processes, and has become a new process with increasingly broad market demand.
in the field of precision thin-walled parts processing, the micro-machining pipe-cutting equipment developed by Kunshan Yunke is highly complementary to the traditional machining process. In laser cutting, it can process any complex opening of metal and non-metal materials. Shape, easy to proof, low cost of proofing. Fine processing precision (±0.01mm), small slit width, high processing efficiency and less hanging slag. The processing yield is high, generally not lower than 98%; in laser welding, most of them are still connected inside the metal, and some are welded by non-metallic materials, such as sealing welding of medical pipe fittings and pipe fittings, transparent injection molding of automobiles. Piece welding; laser marking can laser engrave any graphic (flow number, QR code, logo mark, etc.) on the surface of metal and non-metallic materials. The lack of laser cutting is that its cost is still higher than machining.
At present, the application of laser micromachining equipment in electronic equipment processing mainly has the following related applications. Laser cutting, including SMT stainless steel template, copper, aluminum, molybdenum, nickel titanium, tungsten, magnesium, titanium, magnesium alloy, stainless steel, carbon fiber ABCD parts, ceramics, FPC electronic circuit board, stylus stainless steel pipe fittings, aluminum audio, Smart appliances such as purifiers; laser cutting, blind troughing and welding, including stainless steel, composite battery covers, etc.; laser cutting, welding, marking, including aluminum, stainless steel, ceramics, plastics, mobile phone parts, electronic ceramics, etc. .